What Does "new Motor" Mean?

a motor uses electricity to produce torque and an engine uses gas/diesel/propane/etc. but a lot of people selling cars or trucks dont know the difference and will state new motor when in fact it is a new engine

1. What's the difference between Hub motor,brushless motor and BLDC motor?

Bldc Hub Motor

2. Solar car Brushless DC motor ?

Electric motors in order to rotate, must change magnetic field polarity continuously, as long they rotate. Brush (old) type dc motors have at one side of the rotor (rotating part) a ring from copper (called collector) radially cutted into pieces. Brushless DC motors (newer type if we are talking for something like PC blowers) Have a small electronic circuit which is actually a small oscillator. Now the coils are placed at stator, and connected permanently to this circuit, which changing the polarity of magnetic field continuously. Rotor is just a bunch of permanent magnets. Without brushes friction is less limiting energy loss. The 3 phase motors are ac motors (also brushless), and suggested for your project. Using an external electronic unit called inverter you can drive the motor and change speed also. They are available in several voltages not only 110V. Remember the higher voltage of your system the less energy loss.

3. Why is my motor shaking?

sounds like its either a caliper hanging up or a bad rotor.by your light coming on it might have something to do with your abs,if you got anti-lock brakes

4. Which motor (type) to use for an arduino controlled magnetic stirrer?

I would personally recommend a continuous rotation servo or a brushed DC motor. Personally, for this kind of load, I think it would be easier and cheaper to go with the brushed DC motor. You have to remember a continuous rotation servo is a DC motor with some circuitry so you can send pulses to it to control the speed (although it's not directly proportional to the signal you send). A servo is the only other option besides a brushless motor; both require a little more circuitry than the brushed motor/continuous servo. The additionally cost more. This blog post covers the differences between brushed and brushless motors.For driving a continuous, you hook it up to power [depends on your servo voltage], ground, and another Arduino pin and use the servo library to send a signal as a degree (90 = no speed, 180 = full speed forward, 0 = full speed backward). A brushed you would need a h-bridge that allows you to either send voltage, send no voltage, or send reverse voltage (for backward). This chip ($5) does that for two motors and allows PWM for different speeds. It also includes a brake function, although that does not seem necessary for you. It can handle up to a "2. 4 A continuous (4 A peak). " I talk about this in this answer of mine.Quick note, if you want to control the exact RPM of the device and not just manually adjust it to a good rate, you will need some sort of a rotary encoder or similar. A reed switch (sends current depending on magnetic fields) would work perfectly for this purpose, just mount it below the magnets and figure out the degrees rotated by the motor for each "pulse. ".

5. How much would it cost to fix a cracked motor block ?

You can not repair a cracked engine block. The block must be replaced. You may as well just replace the engine. The car is new enough that it should be worth the money. If you live in North America you can use the link below to find a replacement engine. I assume the standard 1.8L SOHC engine. The going rate seems to be between $1500 to $2500 for an engine. The $2500 engines will have less than 10,000 miles on them. The $1500 engines may have between 13,000 to 40000 miles on them. The link below can search the inventory of most of the auto salvage yards in North America. You will find lots of engines. You can narrow your search by zip code, state, region, country, and everything. I would start by searching by city then by state. Best if you can find one close by to save on shipping costs. You may get lucky and find one close enough that you can go get it yourself and avoid the shipping costs.

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IGBT of Fuji Motor Electronic Equipment Technology
The IGBT technology of Fuji motor and electronic equipment technology has been commercialized since 1988 and has been supplied in the market so far. Figure 1-3 shows the development process and application technology of IGBT products from the first generation to the fifth generation. Epitaxial wafers are used in the first to third generation IGBT, and the characteristics are improved by optimizing life cycle control and refinement technology of IGBT. Then, the fourth and fifth generation products have achieved significant characteristic improvement through the transition from epitaxial wafer to FZ (floating zone) wafer. In this regard, the design policy of IGBT has changed greatly compared with the past.Firstly, the basic design idea of IGBT using epitaxial wafer (series products up to 600V of the third to fourth generation, called "breakdown type") is as follows. In order to realize the low-pass state voltage during IGBT conduction, a large number of carriers are injected from the collector side to fill the IGBT with high concentration carriers. In addition, the n-buffer layer specially set to maintain the high voltage forms a very thin n-layer, so as to realize the low-pass state voltage. In order to realize fast exchange, life cycle control technology aiming at the rapid disappearance of carriers filled in IGBT is also adopted (through these, low exchange loss (eoff) can also be realized). However, once the life cycle control technology is applied, even in the normal on state, due to the effect of this technology (the carrier transport efficiency decreases), there is a problem of increasing the on state voltage, which can be solved by further high carrier injection.In short, the basic design concept of IGBT using epitaxial wafer technology can be simply summarized as "high injection and low transmission efficiency". In contrast, IGBTs using FZ wafers (series after the fourth generation 1200V) adopt a reverse basic design to inhibit the injection of carriers from the collector side and improve the transmission efficiency by reducing the injection efficiency. In the above-mentioned design concept of IGBT using epitaxial wafer "high injection and low transmission efficiency", the carriers that are not easy to be injected are forcibly suppressed through the control of life cycle, which not only limits the improvement of characteristics, but also increases the standard deviation of on-state voltage characteristics through the control of life cycle, It is very disadvantageous to the large capacity required for parallel use with increasing requirements in recent years. The technology developed to overcome this problem is a new IGBT using FZ chip (NPT: non punch through (used from the fourth generation IGBT) / FS: field stop (used from the fifth generation IGBT) - IGBT). The IGBT does not adopt life cycle control. Its basic design idea is to control the impurity concentration of the collector (P layer), so as to inhibit the carrier injection efficiency. However, in order to realize the characteristics superior to the IGBT using epitaxial wafer, it is also required to realize more than one hundred for the 1200V high voltage resistant series IGBT μ M (the thickness of n-layer in NPT and fs-igbt using FZ wafer ≈ the thickness of chip (wafer). The thinner the thickness, the lower the on state voltage can be generated). In short, it is not too much to call the development of IGBT using FZ chip a challenge to chip thickness.Fuji electric and electronic equipment technology has solved these problems. Starting from the fourth generation 1200V series - IGBT, it has realized the commercialization of "s series" constructed by FZ chip NPT. In addition, 600V series technology with higher thickness requirements is further developed, and 600v-u2 series (fifth generation) is being commercialized. In addition, in 1200V series - the fifth generation "U Series", in order to improve the performance better than s series, NPT structure has been changed to FS structure.The so-called FS structure does not use the life cycle control technology. While following the basic design concept of "low injection and high transport efficiency" of carriers, an n buffer layer to maintain voltage is set on the FZ wafer, so as to realize the IGBT structure thinner than the NPT structure. Through this change, 1200v-u series realizes the low on state voltage characteristic better than s series, and completes its commercialization. In addition, this technology is also used in 1700V series high voltage withstand series, and is also starting to be commercialized.Figure 1-3 changes of Fuji motor electronic equipment IGBT application technologyIn addition, Fuji electric and electronic equipment technology is also refining the surface structure indispensable for the improvement of IGBT characteristics (IGBT is formed by multiple IGBT plates. Through refinement, the more plates, the more low on-state voltage can be realized). Up to the fourth generation products, the planar structure (the structure of planar IGBT) has been used to promote refinement, so as to improve the characteristics. However, starting from the fifth generation products - 1200 and 1700V series, the grooved IGBT technology slotted on the Si surface and constituting IGBT has broken the subtle technical barrier and achieved unprecedented characteristic improvement. Figure 1-4 shows the change of characteristic improvement of 1200V series.Figure 1-4 improvement of balance characteristics
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