12.5HP Briggs and Stratton Lawntractor Motor. See Details...?

Briggs And Stratton 12.5 Hp Engine

1. What size motor would be best for 12' aluminum v bottom boat?

Look at the plate on the transom for the largest engine that can be installed. It will be either under or next to where the engine goes, or next to the HIN# which is riveted to the boat

2. What defines the speed at which a motor is retracting and how can it be changed?

It seems like you are particularly talking about your extruder, please correct me if I have misread.In the command G1 F100 X50 Y50 Z0 E-10:If you are not experiencing high enough retraction speed:Notes:

3. Newbie: powering and controling a motor - 12v [closed]

There may be a simpler way to achieve the 90degree movement which would be a 12 volt rotary actuator ( Several on E Bay $50 ish) or a solenoid driving a crank

4. Car clicks, but won't start. It's not the battery, solenoid or starter motor.?

Did you load test the battery? Or just stick a voltmeter on it? Do not assume it's charged and ready just because it reads 12 v. If cleaning the connections and tightening them does not do it (did you check the ground connections?), then pull the bat and take it up to the auto parts store to be properly tested

5. Cloudy Frothy "Milk shake" Motor oil on Dipstick?

you recommend when you are taking it to the recycle midsection? recycled right into a lighter weight of oil. in an engine, some is going as "blow by utilising" and gets wiped out interior the cylinder. or if the seals, gaskets and sealed bearings are failing, then some can migrate into the coolant gadget, and additionally in basic terms leak out onto the floor, or whilst an oil replace is achieved by utilising somebody who does not care appropriate to the ecosystem, the oil finally ends up ultimately the two interior the floor>floor water supply, or lakes and streams, and from there into the meals chain, so ultimately, interior the little organisms that are eaten by utilising the bigger ones, etc to the little fish that are eaten by utilising the bigger fish, and someplace alongside the line positioned on our table at dinner. notably plenty used oil, finally ends up back interior us one way or yet another... controlling us very similar to that "oil" on the "X-documents" gee contemplate whether that became right into a metaphor

6. can i safely use 5w- 50 motor oil in my stock 89' GMC seirra ?

it will be ok. but I suggest using castrol high milage for older vehicles like yours, I used it in my 89 toyota pickup and my truck seemed to run better on it

7. will loose battery cable cause a miss in motor and check engine light to come on in 2000 dodge neon?

A loose battery cable might cause some odd things to happen, but the car will run. Get the CEL code at an auto parts store. When was the timing belt changed? That should be changed every 80k-100k miles. If that is slipping will cause misfires. If it is the timing belt make sure to replace the side motor mount while you have that part of the car opened up. And if they are bad do the upper and lower motor mounts. a>

8. Is it possible for a watercraft to have an inboard AND an outboard motor?

Are you talking about a Personal Watercraft?or a proper Boat/Yacht. My Sailing Yacht has an Inboard Engine below and an emergency outboard in a deck locker.(old rule.3 forms of propulsion)

9. do u notice oil spills frm motor boats in sea water?????

yeah, its the same as it would be in fresh water

10. how we can test acidity number ASTMD-974 for motor oil or base oil?

i think ph meter can be used

11. flushing my coolant out of my radi. and motor of my 92 eldorado?

Most auto parts stores sell a "flush kit" for doing it. It comes with instructions. good luck

12. I have a forced heat furnace in my house. How much would it cost me to have the Blower motor replaced?

THERE MAY NOT BE A PROBLEM WITH THE INDOOR FAN AT ALL. CALL A TECH TO TROUBLESHOOT THE PROBLEM AND GO FROM THERE.

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Artikel yang disarankan
IGBT of Fuji Motor Electronic Equipment Technology
The IGBT technology of Fuji motor and electronic equipment technology has been commercialized since 1988 and has been supplied in the market so far. Figure 1-3 shows the development process and application technology of IGBT products from the first generation to the fifth generation. Epitaxial wafers are used in the first to third generation IGBT, and the characteristics are improved by optimizing life cycle control and refinement technology of IGBT. Then, the fourth and fifth generation products have achieved significant characteristic improvement through the transition from epitaxial wafer to FZ (floating zone) wafer. In this regard, the design policy of IGBT has changed greatly compared with the past.Firstly, the basic design idea of IGBT using epitaxial wafer (series products up to 600V of the third to fourth generation, called "breakdown type") is as follows. In order to realize the low-pass state voltage during IGBT conduction, a large number of carriers are injected from the collector side to fill the IGBT with high concentration carriers. In addition, the n-buffer layer specially set to maintain the high voltage forms a very thin n-layer, so as to realize the low-pass state voltage. In order to realize fast exchange, life cycle control technology aiming at the rapid disappearance of carriers filled in IGBT is also adopted (through these, low exchange loss (eoff) can also be realized). However, once the life cycle control technology is applied, even in the normal on state, due to the effect of this technology (the carrier transport efficiency decreases), there is a problem of increasing the on state voltage, which can be solved by further high carrier injection.In short, the basic design concept of IGBT using epitaxial wafer technology can be simply summarized as "high injection and low transmission efficiency". In contrast, IGBTs using FZ wafers (series after the fourth generation 1200V) adopt a reverse basic design to inhibit the injection of carriers from the collector side and improve the transmission efficiency by reducing the injection efficiency. In the above-mentioned design concept of IGBT using epitaxial wafer "high injection and low transmission efficiency", the carriers that are not easy to be injected are forcibly suppressed through the control of life cycle, which not only limits the improvement of characteristics, but also increases the standard deviation of on-state voltage characteristics through the control of life cycle, It is very disadvantageous to the large capacity required for parallel use with increasing requirements in recent years. The technology developed to overcome this problem is a new IGBT using FZ chip (NPT: non punch through (used from the fourth generation IGBT) / FS: field stop (used from the fifth generation IGBT) - IGBT). The IGBT does not adopt life cycle control. Its basic design idea is to control the impurity concentration of the collector (P layer), so as to inhibit the carrier injection efficiency. However, in order to realize the characteristics superior to the IGBT using epitaxial wafer, it is also required to realize more than one hundred for the 1200V high voltage resistant series IGBT μ M (the thickness of n-layer in NPT and fs-igbt using FZ wafer ≈ the thickness of chip (wafer). The thinner the thickness, the lower the on state voltage can be generated). In short, it is not too much to call the development of IGBT using FZ chip a challenge to chip thickness.Fuji electric and electronic equipment technology has solved these problems. Starting from the fourth generation 1200V series - IGBT, it has realized the commercialization of "s series" constructed by FZ chip NPT. In addition, 600V series technology with higher thickness requirements is further developed, and 600v-u2 series (fifth generation) is being commercialized. In addition, in 1200V series - the fifth generation "U Series", in order to improve the performance better than s series, NPT structure has been changed to FS structure.The so-called FS structure does not use the life cycle control technology. While following the basic design concept of "low injection and high transport efficiency" of carriers, an n buffer layer to maintain voltage is set on the FZ wafer, so as to realize the IGBT structure thinner than the NPT structure. Through this change, 1200v-u series realizes the low on state voltage characteristic better than s series, and completes its commercialization. In addition, this technology is also used in 1700V series high voltage withstand series, and is also starting to be commercialized.Figure 1-3 changes of Fuji motor electronic equipment IGBT application technologyIn addition, Fuji electric and electronic equipment technology is also refining the surface structure indispensable for the improvement of IGBT characteristics (IGBT is formed by multiple IGBT plates. Through refinement, the more plates, the more low on-state voltage can be realized). Up to the fourth generation products, the planar structure (the structure of planar IGBT) has been used to promote refinement, so as to improve the characteristics. However, starting from the fifth generation products - 1200 and 1700V series, the grooved IGBT technology slotted on the Si surface and constituting IGBT has broken the subtle technical barrier and achieved unprecedented characteristic improvement. Figure 1-4 shows the change of characteristic improvement of 1200V series.Figure 1-4 improvement of balance characteristics
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